Demand keeps climbing
Hyperscale AI data center bandwidth and power demand keep rising, and optical interconnect is moving closer to the chip.
Raising · $3M seed
Wafer-scale metalens arrays for AI data center co-packaged optics (CPO)
Upgrade the collimation layer. Keep the proven fiber-array platform.
OneOQ designs flat nano-optics on fused silica for the collimation and coupling layer inside fiber arrays, built for the 1310 nm O-band and for optical interconnect and optical I/O in silicon photonics.
- 1310 & 1550 nmO-band and C-band design
- Q1 2027Samples targeted
- 20M / yrVolume target
Problem
Fiber attach is the bottleneck in co-packaged optics for the AI data center
Fiber attach limits scale
In co-packaged optics (CPO) and near-package optics, the density, alignment and cost of the fiber array interface become first-order constraints for optical I/O.
Collimation has to be precise
Multi-channel fiber arrays need every channel collimated accurately at 1310 nm, across a whole array, at volume.
Solution
A metalens array in place of the refractive microlens layer
The metalens array (MLA) is a flat, lithographically defined nano-optics layer on fused silica. It drops into the collimation and coupling layer of a fiber array, so the fiber-array platform stays and only the collimation layer is upgraded for silicon photonics and co-packaged optics.
Wafer-scale metalens manufacturing
Flat & thin optics
Single-mask
Dicing-friendly
Nano-optic design freedom
IP in progress
Light path
From diverging fiber mode to collimated beam at 1310 nm
Spec snapshot
Engineering sample
| Substrate | Fused silica |
| Pitch | 0.100 to 0.500 mm range |
| Format | Wafer or diced parts, in standard formats (e.g. 12.7 mm diced dies) |
| Coating | AR-coated |
| Design wavelength | 1310 nm (O-band) and 1550 nm band (C-band) |
| Samples | Targeted Q1 2027 |
Engineering-sample targets. Qualification data to follow.
Why now
Optical interconnect is moving next to the chip
AI data center scale-out
Growing hyperscale clusters multiply the number of optical links that have to be built and aligned.
CPO ramp
Co-packaged and near-package optics put the fiber array interface right beside the silicon photonics chip.
Manufacturable nano-optics
A flat, single-mask, dicing-friendly, wafer-scale metalens layer is built to scale like a semiconductor part.
Team & contact
Talk to OneOQ
Hossein Alisafaee, PhD
Founder & CEO, OneOQ LLC
Team of five: one full-time and four part-time.
ceo@oneoq.com
oneoq.com
Fishers, Indiana